Dr. John R. Sporre Profile

Dr. John R. Sporre

Manager of Unit Process Engineering-Patterning at IBM Thomas J Watson Research Ctr

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Publications (16)

Proceedings Article | 4 May 2020 Presentation + Paper

Measuring local CD uniformity in EUV vias with scatterometry and machine learning

Dexin Kong, Daniel Schmidt, Jennifer Church, Chi-Chun Liu, Mary Breton, Cody Murray, Eric Miller, Luciana Meli, John Sporre, Nelson Felix, Ishtiaq Ahsan, Aron Cepler, Marjorie Cheng, Roy Koret, Igor Turovets

Proceedings Volume 11325, 113251I (2020) https://doi.org/10.1117/12.2551498

KEYWORDS: Scatterometry, Machine learning, Semiconducting wafers, Critical dimension metrology, Etching, Photoresist materials, Lithography, Metrology, Scatter measurement, Data modeling

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Proceedings Article | 21 March 2017 Paper

Guiding gate-etch process development using 3D surface reaction modeling for 7nm and beyond

Derren Dunn, John Sporre, Vaibhav Deshpande, Mohamed Oulmane, Ronald Gull, Peter Ventzek, Alok Ranjan

Proceedings Volume 10149, 101490Q (2017) https://doi.org/10.1117/12.2271389

KEYWORDS: Etching, Process modeling, Ions, Image processing, Oxides, Monte Carlo methods, 3D modeling, Plasma etching, Chemical elements, Interfaces, Optical lithography, Plasma, Bromine, Semiconducting wafers

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SPIE Journal Paper | 5 February 2016

Modeling and measuring the transport and scattering of energetic debris in an extreme ultraviolet plasma source

John Sporre, Daniel Elg, Kishor Kalathiparambil, David Ruzic

JM3, Vol. 15, Issue 01, 013503, (February 2016) https://doi.org/10.1117/12.10.1117/1.JMM.15.1.013503

KEYWORDS: Chemical species, Tin, Argon, Scattering, Extreme ultraviolet, Plasma, Autoregressive models, Ions, Calibration, Microchannel plates

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SPIE Journal Paper | 9 February 2015

Magnetic debris mitigation system for extreme ultraviolet sources

Daniel Elg, John Sporre, Davide Curreli, Ivan Shchelkanov, David Ruzic, Karl Umstadter

JM3, Vol. 14, Issue 01, 013506, (February 2015) https://doi.org/10.1117/12.10.1117/1.JMM.14.1.013506

KEYWORDS: Ions, Extreme ultraviolet, Magnetism, Plasma, Extreme ultraviolet lithography, Argon, Electrons, Metrology, Computer simulations, Lithography

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Proceedings Article | 8 April 2013 Paper

Collector optic in-situ Sn removal using hydrogen plasma

John Sporre, Dan Elg, David Ruzic, Shailendra Srivastava, Igor Fomenkov, David Brandt

Proceedings Volume 8679, 86792H (2013) https://doi.org/10.1117/12.2012584

KEYWORDS: Tin, Plasma, Contamination, Etching, Hydrogen, Oxygen, Extreme ultraviolet, Antennas, Carbon, Methane

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Proceedings Article | 1 April 2013 Paper

Contamination concerns at the intermediate focus of an extreme ultraviolet light source

David Ruzic, John Sporre, Dan Elg, Davide Curreli

Proceedings Volume 8679, 86790D (2013) https://doi.org/10.1117/12.2011612

KEYWORDS: Plasma, Argon, Extreme ultraviolet, Neon, Ions, Chemical species, Tin, Sensors, Scattering, Electrodes

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Proceedings Article | 1 April 2013 Paper

Magnetic mitigation of debris for EUV sources

D. Elg, J. Sporre, D. Curreli, D. Ruzic, K. Umstadter

Proceedings Volume 8679, 86792M (2013) https://doi.org/10.1117/12.2011519

KEYWORDS: Ions, Particles, Magnetism, Extreme ultraviolet, Error analysis, MATLAB, Plasma, Lithography, Manufacturing, Argon

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SPIE Journal Paper | 31 May 2012

Debris transport analysis at the intermediate focus of an extreme ultraviolet light source

John Sporre, David Ruzic

JM3, Vol. 11, Issue 02, 021117, (May 2012) https://doi.org/10.1117/12.10.1117/1.JMM.11.2.021117

KEYWORDS: Plasma, Extreme ultraviolet, Ions, Tin, Light sources, Charged particle optics, Argon, Crystals, Carbon, Silicon

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Proceedings Article | 23 March 2012 Paper

Understanding the ion beam in EUV mask blank production

Patrick Kearney, Vibhu Jindal, Alfred Weaver, Pat Teora, John Sporre, David Ruzic, Frank Goodwin

Proceedings Volume 8322, 83221U (2012) https://doi.org/10.1117/12.916510

KEYWORDS: Etching, Ion beams, Ions, Photomasks, Semiconducting wafers, Extreme ultraviolet, Plasma, Oxides, Extreme ultraviolet lithography, Reflectivity

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Proceedings Article | 23 March 2012 Paper

Energetic ion and neutral energy analyzer for extreme-ultraviolet light sources

Daniel Andruczyk, John Sporre, Dan Elg, Tae Cho, David Ruzic

Proceedings Volume 8322, 832237 (2012) https://doi.org/10.1117/12.916437

KEYWORDS: Ions, Sensors, Extreme ultraviolet, Calibration, Plasmas, Light sources, Oscilloscopes, Xenon, Microchannel plates, Visualization

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Proceedings Article | 23 March 2012 Paper

In-situ Sn contamination removal by hydrogen plasma

J. Sporre, D. Elg, D. Andruczyk, T. Cho, D. Ruzic, S. Srivastava, D. Brandt

Proceedings Volume 8322, 83222L (2012) https://doi.org/10.1117/12.916434

KEYWORDS: Etching, Tin, Plasma, Semiconducting wafers, Hydrogen, Silicon, Extreme ultraviolet, Sputter deposition, EUV optics, Plasma etching

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Proceedings Article | 8 April 2011 Paper

Development of an in-situ Sn cleaning method for extreme ultraviolet light lithography

J. Sporre, R. Lofgren, D. Ruzic, O. Khodykin, D. Myers

Proceedings Volume 7969, 796929 (2011) https://doi.org/10.1117/12.881634

KEYWORDS: Tin, Etching, Plasma, Hydrogen, Extreme ultraviolet, Ions, Extreme ultraviolet lithography, Silicon, Lithography, Temperature metrology

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Proceedings Article | 20 March 2010 Paper

Debris measurement at the intermediate focus of a laser-assisted discharge-produced plasma light source

J. Sporre, V. Surla, M. Neumann, D. Ruzic, L. Ren, F. Goodwin

Proceedings Volume 7636, 763611 (2010) https://doi.org/10.1117/12.846590

KEYWORDS: Plasma, Extreme ultraviolet, Tin, Argon, Microchannel plates, Ions, Sensors, Electrodes, Diagnostics, Silicon

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Proceedings Article | 18 March 2009 Paper

Measurement of particle flux at the intermediate focus of a DPP source

J. Sporre, R. Raju, D. Ruzic, V. Surla, F. Goodwin

Proceedings Volume 7271, 727137 (2009) https://doi.org/10.1117/12.814225

KEYWORDS: Ions, Sensors, Particles, Contamination, Extreme ultraviolet, Silicon, Carbon, Plasma, Silicon carbide, Oxygen

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Proceedings Article | 4 December 2008 Paper

EUVL contamination control studies for high-volume manufacturing

D. Ruzic, R. Raju, J. Sporre, H. Shin, W. Lytle, M. Neumann

Proceedings Volume 7140, 714006 (2008) https://doi.org/10.1117/12.804689

KEYWORDS: Particles, Contamination, Ions, Line edge roughness, Extreme ultraviolet, Tin, Plasma, Extreme ultraviolet lithography, Mirrors, Silicon

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Proceedings Article | 21 March 2008 Paper

Ionic debris assessment of various EUVL systems

C. Castano, D. Ruzic, S. Srivastava, K. Thompson, J. Sporre

Proceedings Volume 6921, 692137 (2008) https://doi.org/10.1117/12.774156

KEYWORDS: Ions, Extreme ultraviolet, Calibration, Argon, Plasma, Magnetism, Sensors, Microchannel plates, Spherical lenses, Xenon

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Debris generation in EUV sources is a real threat to the lifetime of collector optics. Debris measurements in these sources are of immense importance to enable source suppliers to estimate collector lifetime. Ion debris measurements performed so far are not consistent and in part incomplete. To verify lifetime claims from different EUV source suppliers, SEMATECH, which is leading this investigation, has collaborated with and provided funding to the Center for Plasma Material Interactions (CPMI) at the University of Illinois to build a fully calibrated and standardized spherical sector electrostatic energy analyzer (ICE). This device is capable of measuring ion debris flux in absolute units. In addition to ion flux, the detector is also capable of identifying different ion species present in the plasma, which can be discriminated based on energy-to-charge ratio. The lifetime of collector optics is calculated using the measured ion flux. This device was fabricated for SEMATECH with the sole aim of traveling to different EUV source suppliers' sites around the world and collecting ion debris data. SEMATECH has measured ion debris from different EUV sources around the world, using a 1 to 14keV ion energy range under different source operational conditions (chamber pressure, pinch frequency, pinch power, angle). These measurements identify the need for debris mitigation in all the EUV sources investigated under this project. They also give source suppliers an opportunity to improve and optimize the performance of their respective sources. The information on absolute ion fluxes is an advantage to source suppliers, allowing them to design and develop effective debris mitigation schemes, which can again be tested for their effectiveness using the ion diagnostic tool. As the debris consists of ions and neutrals, the next logical step is to develop a standardized neutral detector to measure the flux and energy distribution of neutrals present in EUV plasma sources. Taking into account both ions and neutral fluxes, more definitive conclusions on the performance of a EUV source can be made and better collector lifetime estimation models can be derived. The Illinois Calibrated ESA (ICE) tool is now part of the SEMATECH "Flying Circus" equipment set.

Showing 5 of 16 publications

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