Mr. Youngsun Nam Profile

Youngsun Nam

Senior engineer at SAMSUNG Electronics Co Ltd

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Publications (8)

Proceedings Article | 10 April 2024 Poster + Paper

Optical diffraction-based methodology to measure on-product EUV exposure focus variations

Willem op 't Root, Jungwan Park, Youngsun Nam, Seho Kim, Hyunwoo Hwang, Jeong Heung Kong, Sang-Ho Yun, Youngseog Kang, Bram Klaassen, Karel van den Bos, Zhe Hou, Aileen Soco, Don Cheon, Jong-Hyuk Yim, Hong-seung Song, Mi-Yeon Baek, Victor Calado

Proceedings Volume 12955, 129552Q (2024) https://doi.org/10.1117/12.3010370

KEYWORDS: Semiconducting wafers, Metrology, Extreme ultraviolet lithography, Calibration, Extreme ultraviolet, Diffraction gratings, Scanners, Diffraction, Printing, Optical metrology

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Proceedings Article | 24 March 2017 Paper

Reticle heating feed-forward control (RHC2) on NXT:1980Di immersion scanner for enhanced on-product overlay

Young Ha Kim, Jonghoon Jang, Byeong Soo Lee, Hyunwoo Hwang, Youngsun Nam, Jeong-Heung Kong, Young Seog Kang, Se-Yeon Jang, Bart Paarhuis, Jeroen van der Wielen, Barry Moest, Joris Jongen, Stefan Weichselbaum, Niek Verbeek, Marco Stavenga, Roelof de Graaf, Richard Droste

Proceedings Volume 10147, 1014717 (2017) https://doi.org/10.1117/12.2259792

KEYWORDS: Reticles, Scanners, Distortion, HVAC controls, Optical alignment, Control systems, Thermal effects, Temperature metrology, Semiconducting wafers, Overlay metrology, Calibration

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Scanners in High-Volume-Manufacturing conditions will experience a large range of reticles that vary in reticle transmission and reticle diffraction characteristics. Especially under full production loads reticles will heat up due to the exposure light-load and as such experience thermo-mechanical deformations. The resulting reticle pattern distortion can be partially translated in a deteriorated overall system overlay. Due to the geometry of the reticle and exposure fields, these reticle thermal effects are in general barrel-shape distortions that can be well corrected with the available set of lens manipulators. Nevertheless node-over-node the residual overlay errors associated with thermo-mechanical reticle deformation needs further reduction since it contributes to the total onproduct overlay performance. To reduce overlay caused by reticle temperature drift, NXT1980Di includes an active cooling mechanism suppressing the reticle temperature changes during exposure significantly. Even though the reticle temperature excursions are well suppressed, residual intra-wafer overlay drift effect can still be observed. Before exposure of a wafer, reticle deformation is measured during reticle align using in-line alignment / image sensors (TIS or PARIS). This is enabled by adding alignment markers around the circumference of the image field on the reticle. The measured reticle deformations are then fed to the system control network and dynamically corrected for by making use of the available manipulators in the scanner and the projection lens. Wafer-by-wafer reticle distortion measurements are performed to accurately capture the transient dynamics present in reticle heating during normal production lots. A new version of Reticle Heating Feed-forward Control (RHC2) is introduced that uses reticle-heating-induced deformation measurements over time and exposure sequence information to calibrate reticle-deformation-predictionmodels. These models are based on thermo-mechanical models that simulate reticle deformation under various exposure conditions and are applied in-line to the exposures to reduce intra-wafer overlay drift effects.

Proceedings Article | 24 March 2017 Presentation + Paper

Layout independent leveling (LIL) on NXT:1980Di immersion scanners for enhanced productivity

Bram van Hoof, Arjan Holscher, Ralf Gommers, Jeroen Cottaar, Marcel Raas, Samah Khalek, Jan van Kemenade, Maarten Voncken, Roelof de Graaf, Elliot Oti, Stefan Weichselbaum, Richard Droste, ByeongSoo Lee, Chansam Chang, Young Seog Kang, Young Ha Kim, Jeong-Heung Kong, Jong Hoon Jang, YoungSun Nam, Hyunwoo Hwang

Proceedings Volume 10147, 101471A (2017) https://doi.org/10.1117/12.2259794

KEYWORDS: Semiconducting wafers, Sensors, Time metrology, Scanners, Optical alignment, Calibration, Wafer testing, Overlay metrology, Metrology, Computer programming

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SPIE Journal Paper | 29 March 2016

High-order distortion control using a computational prediction method for device overlay

Young Seog Kang, Cedric Affentauschegg, Jan Mulkens, Jang-Sun Kim, Ju Hee Shin, Young Ha Kim, YoungSun Nam, Young-Sin Choi, Hunhwan Ha, Dong-Han Lee, Jae-il Lee, Umar Rizvi, Bernd Geh, Rob van der Heijden, Jan Baselmans, Oh-Sung Kwon

JM3, Vol. 15, Issue 02, 021403, (March 2016) https://doi.org/10.1117/12.10.1117/1.JMM.15.2.021403

KEYWORDS: Overlay metrology, Metrology, Distortion, Control systems, Semiconducting wafers, Scanners, Etching, Information technology, Image processing, Photomasks

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Proceedings Article | 15 March 2016 Paper

Intra-lot wafer by wafer overlay control using integrated and standalone metrology combined sampling

Young Sin Choi, Young Sun Nam, Dong Han Lee, Jae Il Lee, Young Seog Kang, Se Yeon Jang, Jeong Heung Kong

Proceedings Volume 9780, 978009 (2016) https://doi.org/10.1117/12.2219922

KEYWORDS: Semiconducting wafers, Overlay metrology, Metrology, Data corrections, Reticles, HVAC controls, Scanners, Time metrology, Data integration, Lithography, Semiconductors, Control systems, Semiconductor manufacturing, Manufacturing, Computer simulations, Content addressable memory

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Proceedings Article | 18 March 2015 Paper

Overlay improvement methods with diffraction based overlay and integrated metrology

Young-Sun Nam, Sunny Kim, Ju Hee Shin, Young Sin Choi, Sang Ho Yun, Young Hoon Kim, Si Woo Shin, Jeong Heung Kong, Young Seog Kang, Hun Hwan Ha

Proceedings Volume 9426, 942612 (2015) https://doi.org/10.1117/12.2087196

KEYWORDS: Overlay metrology, Metrology, Semiconducting wafers, Diffraction, Target detection, Error analysis, Scanning electron microscopy, Statistical analysis, Manufacturing, Scanners

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Proceedings Article | 18 March 2015 Paper

Solution for high-order distortion on extreme illumination condition using computational prediction method

Young-Seog Kang, Hunhwan Ha, Jang-Sun Kim, Ju Hee Shin, Young Ha Kim, Young Sun Nam, Young-Sin Choi, Cedric Affentauschegg, Rob van der Heijden, Umar Rizvi, Bernd Geh, Eric Janda, Jan Baselmans, Stefan van der Sanden, Oh-Sung Kwon, Mariya Ponomarenko, Daan Slotboom

Proceedings Volume 9426, 942608 (2015) https://doi.org/10.1117/12.2086938

KEYWORDS: Overlay metrology, Distortion, Etching, Metrology, Image processing, Instrument modeling, Data modeling, Calibration, Photomasks, Measurement devices

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Proceedings Article | 12 April 2013 Paper

Lens heating impact analysis and controls for critical device layers by computational method

Du Hyun Beak, Jin Phil Choi, Tony Park, Young Sun Nam, Young Seog Kang, Chan-Hoon Park, Ki-Yeop(Chris) Park, Chang-Hoon Ryu, Wenjin Huang, Ki-Ho Baik

Proceedings Volume 8683, 86831Q (2013) https://doi.org/10.1117/12.2012135

KEYWORDS: Photomasks, Wavefronts, Calibration, 3D modeling, Scanners, Control systems, Semiconducting wafers, Data modeling, Reticles, Diffraction

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Showing 5 of 8 publications

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