Mr. Ryota Harukawa Profile

Ryota Harukawa

Technical Expert at KLA Corp

SPIE Involvement:

Author

Publications (8)

Proceedings Article | 22 March 2016 Paper

DSA materials contributions to the defectivity performance of 14nm half-pitch LiNe flow at IMEC

Hari Pathangi, Varun Vaid, Boon Teik Chan, Nadia Vandenbroeck, Jin Li, Sung Eun Hong, Yi Cao, Baskaran Durairaj, Guanyang Lin, Mark Somervell, Takahiro Kitano, Ryota Harukawa, Kaushik Sah, Andrew Cross, Hareen Bayana, Lucia D’Urzo, Roel Gronheid

Proceedings Volume 9777, 97770G (2016) https://doi.org/10.1117/12.2219936

KEYWORDS: Directed self assembly, Metrology, Optical lithography, Silicon, Semiconducting wafers, Etching, Bridges, Polymers, Manufacturing, Scanning electron microscopy, Epitaxy, Lithography, Thin film coatings

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SPIE Journal Paper | 2 July 2015

Defect mitigation and root cause studies in 14 nm half-pitch chemo-epitaxy directed self-assembly LiNe flow

Hari Pathangi, Boon Teik Chan, Hareen Bayana, Nadia Vandenbroeck, Dieter Van den Heuvel, Lieve Van Look, Paulina Rincon-Delgadillo, Yi Cao, JiHoon Kim, Guanyang Lin, Doni Parnell, Kathleen Nafus, Ryota Harukawa, Ito Chikashi, Marco Polli, Lucia D’Urzo, Roel Gronheid, Paul Nealey

JM3, Vol. 14, Issue 03, 031204, (July 2015) https://doi.org/10.1117/12.10.1117/1.JMM.14.3.031204

KEYWORDS: Etching, Scanning electron microscopy, Silicon, Inspection, Semiconducting wafers, Diffractive optical elements, Defect inspection, Thin film coatings, Directed self assembly

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Proceedings Article | 19 March 2015 Paper

Defect mitigation and root cause studies in IMEC's 14nm half-pitch chemo-epitaxy DSA flow

Hari Pathangi, Boon Teik Chan, Hareen Bayana, Nadia Vandenbroeck, Dieter Van Den Heuvel, Lieve Van Look, Paulina Rincon-Delgadillo, Yi Cao, JiHoon Kim, Guanyang Lin, Doni Parnell, Kathleen Nafus, Ryota Harukawa, Ito Chikashi, Venkat Nagaswami, Lucia D'Urzo, Roel Gronheid, Paul Nealey

Proceedings Volume 9423, 94230M (2015) https://doi.org/10.1117/12.2085889

KEYWORDS: Etching, Silicon, Bridges, Scanning electron microscopy, Inspection, Diffractive optical elements, Semiconducting wafers, Thin film coatings, Defect inspection, Directed self assembly

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Proceedings Article | 2 April 2014 Paper

Defect analysis methodology for contact hole grapho epitaxy DSA

Ryota Harukawa, Masami Aoki, Andrew Cross, Venkat Nagaswami, Shinichiro Kawakami, Takashi Yamauchi, Tadatoshi Tomita, Seiji Nagahara, Makoto Muramatsu, Takahiro Kitano

Proceedings Volume 9050, 905027 (2014) https://doi.org/10.1117/12.2046051

KEYWORDS: Inspection, Wafer-level optics, Scanning electron microscopy, Wafer inspection, Defect detection, Semiconducting wafers, Optical lithography, Epitaxy, Defect inspection, Directed self assembly

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Proceedings Article | 28 March 2014 Paper

Inspection of directed self-assembly defects

Chikashi Ito, Stephane Durant, Steve Lange, Ryota Harukawa, Takemasa Miyagi, Venkat Nagaswami, Paulina Rincon Delgadillo, Roel Gronheid, Paul Nealey

Proceedings Volume 9049, 90492D (2014) https://doi.org/10.1117/12.2046634

KEYWORDS: Inspection, Signal to noise ratio, Etching, Semiconducting wafers, Silicon, Wafer inspection, Defect inspection, Line edge roughness, Wafer-level optics, Directed self assembly

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Proceedings Article | 28 March 2014 Paper

Defect reduction and defect stability in IMEC's 14nm half-pitch chemo-epitaxy DSA flow

Roel Gronheid, Paulina Rincon Delgadillo, Hari Pathangi, Dieter Van den Heuvel, Doni Parnell, Boon Teik Chan, Yu-Tsung Lee, Lieve Van Look, Yi Cao, YoungJun Her, Guanyang Lin, Ryota Harukawa, Venkat Nagaswami, Lucia D'Urzo, Mark Somervell, Paul Nealey

Proceedings Volume 9049, 904905 (2014) https://doi.org/10.1117/12.2047265

KEYWORDS: Etching, Inspection, Silicon, Semiconducting wafers, Scanning electron microscopy, Defect inspection, Polymethylmethacrylate, Particles, Critical dimension metrology, Directed self assembly

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Proceedings Article | 18 April 2013 Paper

DSA hole defectivity analysis using advanced optical inspection tool

Ryota Harukawa, Masami Aoki, Andrew Cross, Venkat Nagaswami, Tadatoshi Tomita, Seiji Nagahara, Makoto Muramatsu, Shinichiro Kawakami, Hitoshi Kosugi, Benjamen Rathsack, Takahiro Kitano, Jason Sweis, Ali Mokhberi

Proceedings Volume 8681, 86811A (2013) https://doi.org/10.1117/12.2011177

KEYWORDS: Inspection, Semiconducting wafers, Wafer inspection, Reticles, Wafer-level optics, Epitaxy, Optical inspection, Defect inspection, Optical lithography, Directed self assembly

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Proceedings Article | 26 March 2013 Paper

Defect source analysis of directed self-assembly process (DSA of DSA)

Paulina Rincon Delgadillo, Ryota Harukawa, Mayur Suri, Stephane Durant, Andrew Cross, Venkat Nagaswami, Dieter Van Den Heuvel, Roel Gronheid, Paul Nealey

Proceedings Volume 8680, 86800L (2013) https://doi.org/10.1117/12.2011674

KEYWORDS: Semiconducting wafers, Etching, Inspection, Critical dimension metrology, Particles, Scanning electron microscopy, Plasma etching, Polymethylmethacrylate, Thin film coatings, Directed self assembly

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Showing 5 of 8 publications

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