Designing metrology targets that mimic process device cell behavior is becoming a common component in overlay process control. For an advanced DRAM process (sub 20 nm node), the extreme illumination methods needed to pattern the critical device features makes it harder to control the aberration induced overlay delta between metrology target and device patterns. To compensate for this delta, a Non-Zero-Offset is applied to the metrology measurement that is based on a manual calibration measurement using CD-SEM Overlay.
In this paper, we document how this mismatch can be minimized through the right choice of metrology targets and measurement recipe.
Overlay metrology performances highly depend on the detailed design of the measured target. Hence performing simulations is an essential tool for optimizing target design. We demonstrate for scatterometry overlay (SCOL) three key factors which enable consistency in ranking between simulated and measured metrology performance for target design. The first factor, to enable high fidelity simulations for the purpose of target design, is stack and topography verification of model inputs. We report in detail the best known film metrology methods required to achieve model integrity. The second factor is the method of calculation of metrology performance metrics based on target cell reflectivities from electro-magnetic (EM) simulations. These metrics enable ranking of different designs, and subsequent choice of the best performing designs among all simulated design options, the ranking methodology being the third factor. We apply the above steps to a specific stack, where five different designs have been considered. Simulated versus measured values are compared. A good agreement between simulation and measurement is achieved.
Scribe Line Marks (SLM) printed on substrates are a standard method used by modern scanners for wafer alignment.
Light reflected from the SLM forms a diffraction pattern which is used to determine the exact position of the wafer. The
signal strength of the diffraction order needs to reach a certain threshold for the scanner to detect it. The marks are
changed as the wafers go through various processes and are buried underneath complex film stacks. These processes
and stacks can severely reduce wafer quality (WQ). Equipment manufactures recommend several variations of the SLM
to improve WQ but these variations are not effective for certain advanced processes. This paper discusses theoretical
analysis of how SLM designs affect wafer quality, addresses the challenge of self-aligned double patterning (SADP) on
SLMs and experimentally verifies results using various structures.
As the industry drives to lower k1 imaging we commonly accept the use of higher NA imaging and advanced
illumination conditions. The advent of this technology shift has given rise to very exotic pupil spread functions that
have some areas of high thermal energy density creating new modeling and control challenges. Modern scanners are
equipped with advanced lens manipulators that introduce controlled adjustments of the lens elements to counteract the
lens aberrations existing in the system. However, there are some specific non-correctable aberration modes that are
detrimental to important structures. In this paper, we introduce a methodology for minimizing the impact of aberrations
for specific designs at hand. We employ computational lithography to analyze the design being imaged, and then devise
a lens manipulator control scheme aimed at optimizing the aberration level for the specific design. The optimization
scheme does not minimize the overall aberration, but directs the aberration control to optimize the imaging performance,
such as CD control or process window, for the target design. Through computational lithography, we can identify the
aberration modes that are most detrimental to the design, and also correlations between imaging responses of
independent aberration modes. Then an optimization algorithm is applied to determine how to use the lens manipulators
to drive the aberrations modes to levels that are best for the specified imaging performance metric achievable with the
tool. We show an example where this method is applied to an aggressive memory device imaged with an advanced ArF
scanner. We demonstrate with both simulation and experimental data that this application specific tool optimization
successfully compensated for the thermal induced aberrations dynamically, improving the imaging performance
consistently through the lot.
Scanner matching based on wafer data has proven to be successful in the past years, but its adoption into production has
been hampered by the significant time and cost overhead involved in obtaining large amounts of statistically precise
wafer CD data. In this work, we explore the possibility of optical model based scanner matching that maximizes the use
of scanner metrology and design data and minimizes the reliance on wafer CD metrology.
A case study was conducted to match an ASML ArF immersion scanner to an ArF dry scanner for a 6Xnm technology
node. We used the traditional, resist model based matching method calibrated with extensive wafer CD measurements
and derived a baseline scanner manipulator adjustment recipe. We then compared this baseline scanner-matching recipe
to two other recipes that were obtained from the new, optical model based matching method. In the following sections,
we describe the implementation of both methods, provide their predicted and actual improvements after matching, and
compare the ratio of performance to the workload of the methods. The paper concludes with a set of recommendations
on the relative merits of each method for a variety of use cases.
A top challenge for Photolithographers during a process transfer involving multiple-generation scanners is tool
matching. In a more general sense, the task is to ensure that the wafer printing results in the receiving fab will match or
even exceed those of the originating fab. In this paper we report on two strategies that we developed to perform a photo
process transfer that is tailored to the scanner's capabilities. The first strategy presented describes a method to match the
CD performance of the product features on the transferred scanner. A second strategy is then presented which considers
also the down-stream process tools and seeks to optimize the process for yield. Results presented include: ASML
TWINSCANTM XT:1700i and XT:1900i scanners 1D printing results from a line-space test reticle, parametric sensitivity
calculations for the two scanners on 1D patterns, simulation predictions for a process-optimized scanner-matching
procedure, and final wafer results on 2D production patterns. Effectiveness of the optimization strategies was then
concluded.
The use of transverse electric (TE) polarization has dominated illumination schemes as selective polarization is
used for high-NA patterning. The benefits of TE polarization are clear - the interference of diffracted beams remains
absolute at oblique angles. Transverse magnetic (TM) polarization is usually considered less desirable as imaging
modulation from interference at large angle falls off rapidly as the 1/cosθ. Significant potential remains, however, for
the use of TM polarization at large angles when its reflection component is utilized. By controlling the resist/substrate
interface reflectivity, high modulation for TM polarization can be maintained for angles up to 90° in the resist. This can
potentially impact the design of illumination away from most recent TE-only schemes for oblique imaging angles (high
NA). We demonstrate several cases of TM illumination combined with tuned substrate reflectivity for 0.93NA, 1.20NA,
and 1.35NA and compare results to TE and unpolarized cases. The goal is to achieve a flat response through polarization
at large imaging angles.
An additional application of TM illumination is its potential use for double patterning. As double patterning
and double exposure approaches are sought in order to meet the needs of 32nm device generations and beyond, materials
and process engineering challenges become prohibitive. We have devised a method for frequency doubling in a single
exposure using an unconventional means of polarization selection and by making use of the reflective component
produced at the photoresist/substrate interface. In doing so, patterns can be deposited into a photoresist film with double
density. As an example, using a projection system numerical aperture of 1.20, with water as an immersion fluid, and a
conventional polyacrylate 193nm photoresist, pattern resolution at 20nm half-pitch are obtainable (which is
0.125lambda/NA). The process to transfer this geometry into a hardmask layer uses conventional materials, including
the photoresist layer and thin film silicon oxide based materials.
State of the art lithography is continually driven to resolve increasingly smaller features, forcing k1 values
for lithography processes ever lower. In order to image these difficult features with reliable fidelity,
lithographers must increasingly use Resolution Enhancement Techniques (RETs). One such technique that
is proposed in this paper uses small, sub-wavelength grooves placed in close proximity to an aperture.
These sub-wavelength grooves create evanescent fields bound to the surface between the absorber and the
mask substrate, decaying exponentially in lateral directions. In this work we demonstrate the ability to use
such Evanescent Wave Assist Features (EWAFs) to enhance the propagating near and far field energy
within openings such as slits and contacts. Using a Finite Difference Time Domain model, the effects of
these evanescent wave assist features are explored in both the near and far field regions. Several cases of
absorber material, feature type, spacing, and illumination will be presented.
The progress of optical lithography has approached the sub-30 nm regime using 193nm excimer lasers as the
exposure sources. To increase the numerical aperture (NA) further, many issues, especially those related to materials,
need to be addressed. In this paper, we present the analytical and experimental results of oblique two-beam lithography
with sapphire (Al2O3) as the optical material. At 193nm, the index of sapphire is 1.92 while the typical index of a
photoresist is near 1.70. Classical theory predicts that, ignoring the absorbance in the photoresist, once the NA is greater
than the photoresist refractive index, no energy will be transmitted across the sapphire/photoresist boundary due to total
internal reflection. However, it can be shown that the absorbance in the resist prevents a "critical angle" and total internal
reflection will not occur. Photoresist exposure can result even when NA is greater than the photoresist refractive index.
The image profile is strongly affected by the real and imaginary parts of the photoresist refractive index. Optimization of
photoresist optical properties is necessary for good image profile. Lutetium aluminum garnet (Lu3Al5O12 or LuAG with
an index 2.14 at 193 nm) is also investigated as an alternative lens material.
As immersion lithography is extended to ever increasing resolution, the resulting propagation angles in the
materials involved become closer to grazing than to normal incidence. Classical laws of refraction and reflection cannot
be used with either assumption however, as a collection of angles may exist across the entire range. Fresnel reflection at
these angles becomes large enough that small disparities in refractive indices at material interfaces may lead to adverse
effects. As an example, when water is used at numerical apertures approaching its refractive index, reflection effects are
greater than the constraints imposed by refraction or absorption. This will limit the maximum NA value allowed by any
given material to values sufficiently lower than its refractive index. Additionally, we have grown accustom to expanding
the application of the Snell-Descartes Law to materials with low absorption, assuming that the contribution of the
imaginary component of the refractive index is negligible. This is not the case for photoresists, fluids, or glasses, which
can not strictly be considered as non-absorbing media. We have expanded the Snell-Descartes Law for absorbing media,
with some interesting consequences. We will show that there is no real limit on the numerical aperture into a material,
so long as its extinction coefficient is not zero. The relationship that lithographers have been using recently where NA<
min[nglass, nfluid, nresist] will be shown to be inadequate and imaging at numerical apertures up to 1.85 will be demonstrated
using materials with significantly lower (real) refractive index values.
In a search for alkane candidates for 193 nm immersion fluids, several alkanes and cycloalkanes were synthesized,
purified and screened to ascertain their absorption at 193 nm, refractive index and temperature dispersion coefficient in
the context of the actual application. In general, cycloalkanes, and more specifically polycycloalkanes, possess a higher
refractive index than do linear alkanes. Decalin, cyclodecane, perhydrophenanthreme (PHP), perhydrofluorene (PHF)
and perhydropyrene (PHPY) are examined as potential second and third generation immersion fluids. The use of
perhydropyrene, which possesses a high refractive index of 1.7014 at 193 nm, may be limited as an immersion fluid
because of high absorption at 193 nm. Mixtures of cycloalkanes can lead to a higher enhancement of the refractive index
together with a decrease on the viscosity. Exhaustive purification of the fluids is a critical step in determining the real
absorption of the different fluids at 193 nm. Two simple purification processes of these cycloalkanes were developed
that led to low absorption fluids in the VUV region. The possibility of forming the oxygen complex in aerated fluids was
reduced by purging samples with argon or nitrogen. This easy elimination of the oxygen complex shows the weak
bonding nature of this complex.
Immersion interferometric lithography has been applied successfully to semiconductor device applications, but its potential is not limited to this application only. This paper explores this imaging technology for the production of three-dimensional nano-structures using a 193 nm excimer laser and immersion Talbot interferometric lithographic tool. The fabrication of 3-D photonic crystals for the UV spectrum is still considered to be a challenge. A systematic analysis of immersion lithography for 3-D photonic crystal fabrication will be provided in this paper. Significant progress has been made on optical immersion lithography since it was first proposed. Two-beam immersion interferometric lithography can provide sub-30nm resolution. By changing the exposure parameters, such as the numerical aperture of the exposure system, the polarization states and wavelength of the illumination source, 30 nm polymeric nanospheres with different crystal structures can be fabricated.
New applications of evanescent imaging for microlithography are introduced. The use of evanescent wave lithography (EWL) has been employed for 26nm resolution at 1.85NA using a 193nm ArF excimer laser wavelength to record images in a photoresist with a refractive index of 1.71. Additionally, a photomask enhancement effect is described using evanescent wave assist features (EWAF) to take advantage of the coupling of the evanescent energy bound at the substrate-absorber surface, enhancing the transmission of a mask opening through coupled interference.
Interference imaging systems are being used more extensively for R&D applications where NA manipulation, polarization control, relative beam attenuation, and other parameters are explored and projection imaging approaches may not exist. To facilitate interferometric lithography research, we have developed a compact simulation tool, ILSim, for studying multi-beam interferometric imaging, including fluid immersion lithography. The simulator is based on full-vector interference theory, which allows for application at extremely high NA values, such as those projected for use with immersion lithography. In this paper, ILSim is demonstrated for use with two-beam and four-beam interferometric immersion lithography. The simulation tool was written with Matlab, where the thin film assembly (ambient, top coat, resist layer, BARC layers, and substrate) and illumination conditions (wavelength, polarization state, interference angle, demodulation, NA) can be defined. The light intensity distributions within the resist film for 1 exposure or 2-pass exposure are displayed in the graph window. It also can optimize BARC layer thickness and top coat thickness.
Immersion lithography has become attractive since it can reduce critical dimensions by increasing numerical aperture (NA) beyond unity. Among all the candidates for immersion fluids, those with higher refractive indices are desired. However, for many of the fluids, the strong absorption at 193nm becomes a serious problem. Therefore, it is essential to find a fluid that is transparent enough (with absorbance less than 0.5mm-1) and has high refractive index (above water, 1.44) at 193nm. Characterization of various fluid candidates has been performed and the absorbance of these fluids has been measured. To measure the absolute refractive index, a prism deviation angle method was developed. This method offers the possibility of measuring fluid refractive indices accurately. This paper also presents the obtained refractive indices of these fluids. Several candidates have been identified for 193nm application with refractive indices near 1.55, which is about 0.1 higher than that of water at this wavelength. Cauchy parameters of these fluids were generated and approaches were investigated to tailor the fluid absorption edges to be close to 193nm. The effects of these fluids on photoresist performance were also examined with 193nm immersion lithography exposure at various NA's. 1.5 NA was obtained to image 32nm lines with phosphoric acid as the immersion medium. These fluids are potential candidates for immersion lithography technology.
Interference lithography has been widely utilized as a tool for the evaluation of photoresist materials, as well as emerging resolution enhancement techniques such as immersion lithography. The interferometric approach is both simple and inexpensive to implement, however it is limited in its ability to examine the impact of defocus due to the inherently large DOF (Depth-of-Focus) in two-beam interference. Alternatively, the demodulation of the aerial image that occurs as a result of defocus in a projection system may be synthesized using a two pass exposure with the interferometric method. The simulated aerial image modulation for defocused projection systems has been used to calculate the single beam exposure required to reproduce the same level of modulation in an interferometric system through the use of a “Modulation Transfer Curve”. The two methods have been theoretically correlated, by way of modulation for projection illumination configurations, including quadrupole and annular. An interferometric exposure system was used to experimentally synthesize defocus for modulations of 0.3, 0.5, 0.7 and 1.0. Feature sizes of 90nm were evaluated across dose and synthetic focus.
In order to find new immersion liquids to improve the resolution of 193 nm immersion photolithography, we have attempted to discover aqueous system possessing an index of refraction greater than that of water using aqueous surfactant systems. The index of refraction (RI) of both cationic and anionic surfactant systems were examined in the presence of wide range of inorganic salts, and parameters such as size of surfactants, concentrations, and temperature were varied. The refractive index (RI) was found to be increased in the presence of both anionic and cationic surfactants compared to those of water and also increased as a function of surfactant concentration. However the refractive index tends to increase much more strongly as a function of salt concentration. In our study, a maximum RI enhancement was observed from 6.5 M CdCl2 in 8.2 mM aqueous SDS solution. The effect of micellar properties such as the critical micelle concentration (cmc) and degree of ionization were systematically studied for aqueous SDS system in the presence of CdCl2. The correlation on index of refraction between empirical data and theoretical prediction were performed using the concept of molar refraction. Wavelength dependence of RI from theoretical prediction based on empirical equation was examined for various concentration of CdCl2 system and the results are reported in the paper.
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