Mr. John G. Maltabes Profile

John G. Maltabes

Technical Director

SPIE Involvement:

Author

Area of Expertise:

Imprint Lithography , Defect reduction , Litho Strategy , DUV/EUV lithography , Yield learning

Publications (29)

Proceedings Article | 21 March 2012 Paper

Paper

Planarization coating for polyimide substrates used in roll-to-roll fabrication of active matrix backplanes for flexible displays

A. Marcia Almanza-Workman, Albert Jeans, Steve Braymen, Richard Elder, Robert Garcia, Alejandro de la Fuente Vornbrock, Jason Hauschildt, Edward Holland, Warren Jackson, Mehrban Jam, Frank Jeffrey, Kelly Junge, Han-Jun Kim, Ohseung Kwon, Don Larson, Hao Luo, John Maltabes, Ping Mei, Craig Perlov, Mark Smith, Dan Stieler, Carl Taussig, Steve Trovinger, Lihua Zhao

Proceedings Volume 8323, 83231K (2012) https://doi.org/10.1117/12.916748

KEYWORDS: Coating, Dielectrics, Thin films, Etching, Scanning electron microscopy, Flexible displays, Ultraviolet radiation, Plasma enhanced chemical vapor deposition, Inspection, Lithography

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Proceedings Article | 3 April 2010 Paper

Paper

Advances in roll-to-roll imprint lithography for display applications

Albert Jeans, Marcia Almanza-Workman, Robert Cobene, Richard Elder, Robert Garcia, Fernando Gomez-Pancorbo, Warren Jackson, Mehrban Jam, Han-Jun Kim, Ohseung Kwon, Hao Luo, John Maltabes, Ping Mei, Craig Perlov, Mark Smith, Carl Taussig, Frank Jeffrey, Steve Braymen, Jason Hauschildt, Kelly Junge, Don Larson, Dan Stieler

Proceedings Volume 7637, 763719 (2010) https://doi.org/10.1117/12.852268

KEYWORDS: Lithography, Photomasks, Transistors, Etching, Coating, Silicon, Polymers, Quartz, Atrial fibrillation, Semiconducting wafers

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Proceedings Article | 19 May 2008 Paper

Paper

32 nm imprint masks using variable shape beam pattern generators

Kosta Selinidis, Ecron Thompson, Gerard Schmid, Nick Stacey, Joseph Perez, John Maltabes, Douglas Resnick, Jeongho Yeo, Hoyeon Kim, Ben Eynon

Proceedings Volume 7028, 70280R (2008) https://doi.org/10.1117/12.793034

KEYWORDS: Semiconducting wafers, Line width roughness, Lithography, Etching, Photomasks, Critical dimension metrology, Beam shaping, Overlay metrology, Manufacturing, Line edge roughness

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Proceedings Article | 21 March 2008 Paper

Paper

High resolution defect inspection of step and flash imprint lithography for 32 nm half-pitch patterning

I. McMackin, J. Perez, K. Selinidis, J. Maltabes, D. Resnick, S. Sreenivassan

Proceedings Volume 6921, 69211L (2008) https://doi.org/10.1117/12.773970

KEYWORDS: Photomasks, Inspection, Semiconducting wafers, Particles, Lithography, Defect inspection, Etching, Optical lithography, Image processing, Manufacturing

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Proceedings Article | 16 November 2007 Paper

Paper

Defect reduction progress in step and flash imprint lithography

K. Selenidis, J. Maltabes, I. McMackin, J. Perez, W. Martin, D. Resnick, S. Sreenivasan

Proceedings Volume 6730, 67300F (2007) https://doi.org/10.1117/12.747565

KEYWORDS: Inspection, Semiconducting wafers, Lithography, Particles, Defect inspection, Ultraviolet radiation, Contamination, Ions, Image processing, Wafer inspection

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Proceedings Article | 21 March 2007 Paper

Paper

A study of imprint-specific defects in the step and flash imprint lithography process

J. Perez, K. Selinidis, S. Johnson, B. Fletcher, F. Xu, J. Maltabes, I. McMackin, D. Resnick, S. Sreenivasan

Proceedings Volume 6517, 65170L (2007) https://doi.org/10.1117/12.720673

KEYWORDS: Particles, Inspection, Lithography, Semiconducting wafers, Manufacturing, Photomasks, Optical lithography, Ultraviolet radiation, Defect detection, Silica

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Researchers have demonstrated that imprint lithography techniques have remarkable replication resolution and can pattern sub-5nm structures. However, a fully capable lithography approach needs to address several challenges in order to be useful in manufacturing. For successful manufacturing insertion of Step and Flash Imprint Lithography (S-FILTM) into a broad set of applications such as photonics, magnetic storage, and integrated circuits (ICs), the following practical process related challenges need to be addressed: (i) Printing sub-50nm structures with non-uniform pattern densities: (ii) Precise alignment and overlay with the ability to mix-and-match with photolithography; (iii) Availability of 1X templates; (iv) Achieving appropriate throughput for acceptable cost of ownership; and (v) Minimizing template and imprint process-induced defects to allow acceptable process yields. The last challenge - the ability to achieve low defect densities - is desirable for all applications. However, it is one of the biggest challenges for S-FIL to be accepted in IC fabrication. This article specifically focuses on this last challenge and presents the current status of defect reduction in S-FIL technology. The article starts out by providing a brief background of S-FIL technology, and by including a discussion of the overall status of S-FIL technology in Section 1. Next, an overview of the experiments performed including the defect inspection approaches used is provided in Section 2. Section 3 introduces the classes of defects that are relevant to the S-FIL process. It also provides recent defect data for each of these classes. Section 4 presents defect data gathered over the last three years and provides defect reduction trends over this period. Section 5 discusses the topic of template lifetime. Finally Section 6 provides some concluding remarks. The defect data presented here is based on a large number of short-loop experiments based on optical inspection of templates and wafers; these data are complemented by a modest number of high resolution e-beam inspections to provide insight into S-FIL specific defects at leading edge line widths.

Proceedings Article | 19 May 2006 Paper

Paper

Mask repair technique assessment and development for the 45nm lithographic node

H. Marchman, D. Taylor, S. Hadisutjipto, S. Mackay, R. Cottle, J. Maltabes, J. Brown

Proceedings Volume 6283, 628311 (2006) https://doi.org/10.1117/12.681862

KEYWORDS: Photomasks, Ions, Etching, Ion beams, Lithography, Molecules, Electron beams, Image resolution, Scanning electron microscopy, Signal to noise ratio

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Proceedings Article | 23 March 2006 Paper

Paper

Building 1x NIL templates: challenges and requirements

Tony DiBiase, John Maltabes, Bryan Reese, Mohsen Ahmadian

Proceedings Volume 6151, 61511E (2006) https://doi.org/10.1117/12.655887

KEYWORDS: Nanoimprint lithography, Reticles, Inspection, Manufacturing, Lithography, Photomasks, Etching, Quartz, Defect inspection, Image transmission

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Proceedings Article | 23 March 2006 Paper

Paper

Increasing effective resolution through surface conditioners for 1x imprint templates and photo mask applications beyond 65nm

Kosta Selinidis, John Maltabes, Madhukar Rao, Peng Zhang

Proceedings Volume 6151, 615114 (2006) https://doi.org/10.1117/12.657620

KEYWORDS: Photomasks, Photoresist processing, Etching, Manufacturing, Resolution enhancement technologies, Capillaries, Lithography, Semiconducting wafers, Mask making, Liquids

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Proceedings Article | 9 November 2005 Paper

Paper

An integrated approach to the analysis of imprint vs. optical lithography, or why this is not just a mask discussion

John Maltabes, R. Scott Mackay, Rand Cottle

Proceedings Volume 5992, 59924A (2005) https://doi.org/10.1117/12.632207

KEYWORDS: Lithography, Photomasks, Manufacturing, Semiconductors, Reticles, Etching, Optical lithography, Semiconducting wafers, Nanoimprint lithography, Inspection

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Proceedings Article | 18 August 2005 Paper

Paper

Current imprint template commercial manufacturing capability for nanotechnology and existing semiconductor and MEMS markets

John Maltabes, Scott Mackay, Rand Cottle

Proceedings Volume 5931, 59311H (2005) https://doi.org/10.1117/12.629499

KEYWORDS: Lithography, Manufacturing, Semiconductors, Photomasks, Etching, Reticles, Microelectromechanical systems, Optical lithography, Optics manufacturing, Nanotechnology

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Proceedings Article | 26 June 2003 Paper

Paper

Mighty high-T lithography for 65-nm generation contacts

Will Conley, Patrick Montgomery, Kevin Lucas, Lloyd Litt, John Maltabes, Laurent Dieu, Gregory Hughes, David Mellenthin, Robert Socha, Eric Fanucchi, Arjan Verhappen, Kurt Wampler, Linda Yu, Erika Schaefer, Shawn Cassel, Jan Kuijten, Wil Pijnenburg, Vincent Wiaux, Geert Vandenberghe

Proceedings Volume 5040, (2003) https://doi.org/10.1117/12.485499

KEYWORDS: Photomasks, Lithography, Inspection, Reticles, Optical lithography, Lithographic illumination, Binary data, Manufacturing, 193nm lithography, Semiconducting wafers

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Proceedings Article | 27 December 2002 Paper

Paper

Advanced 193 tri-tone EAPSM (9% to 18%) for 65-nm node

Laurent Dieu, Eric Fanucchi, Greg Hughes, John Maltabes, David Mellenthin, Will Conley, Lloyd Litt, Kevin Lucas, Robert Socha, Kurt Wampler, Arjan Verhappen, Jan-Pieter Kiujten

Proceedings Volume 4889, (2002) https://doi.org/10.1117/12.467783

KEYWORDS: Reticles, Inspection, Multilayers, Tin, Manufacturing, Lithography, Etching, Photomasks, Process control, Transmittance

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Proceedings Article | 30 July 2002 Paper

Paper

Effect of quartz phase etch on 193-nm alternating phase-shift mask performance for the 100-nm node

Kyle Patterson, Lloyd Litt, John Maltabes, Greg Hughes, Trish Robertson, B. Montgomery

Proceedings Volume 4691, (2002) https://doi.org/10.1117/12.474481

KEYWORDS: Reticles, Photomasks, Data modeling, Etching, Quartz, Semiconducting wafers, Optical lithography, Phase shifts, Lithography, Phase shifting

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Proceedings Article | 11 March 2002 Paper

Paper

ArF (193-nm) alternating aperture PSM quartz defect repair and printability for 100-nm node

Jerry Chen, John Riddick, Matt Lamantia, Azeddine Zerrade, Robert Henderson, Greg Hughes, Cyrus Tabery, Khoi Phan, Chris Spence, Amy Winder, William Stanton, Eugene Delarosa, John Maltabes, Cecilia Philbin, Lloyd Litt, Anthony Vacca, Scott Pomeroy

Proceedings Volume 4562, (2002) https://doi.org/10.1117/12.458362

KEYWORDS: Quartz, Photomasks, Semiconducting wafers, Scanning electron microscopy, Etching, Atomic force microscopy, Ions, Reticles, Inspection, Critical dimension metrology

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Proceedings Article | 28 September 2001 Paper

Paper

Progress on 300-mm wafer lithography equipment and processes

Karl Mautz, John Maltabes

Proceedings Volume 4557, (2001) https://doi.org/10.1117/12.442959

KEYWORDS: Semiconducting wafers, Scanners, Lithography, Deep ultraviolet, Optical alignment, Critical dimension metrology, Overlay metrology, Manufacturing, Image processing, Reliability

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Proceedings Article | 18 August 2000 Paper

Paper

Is lithography ready for 300 mm?

Alain Charles, Clint Haris, Steffen Hornig, Dietmar Ganz, Thorsten Schedel, Guenther Hraschan, Wolfram Koestler, John Maltabes, Karl Mautz, Sebastian Schmidt, Ralf Schuster

Proceedings Volume 4181, (2000) https://doi.org/10.1117/12.395736

KEYWORDS: Lithography, Semiconducting wafers, Photoresist developing, Scanners, Deep ultraviolet, Semiconductors, Manufacturing, Photoresist materials, Thin film coatings

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Proceedings Article | 5 July 2000 Paper

Paper

Process performance comparisons on 300-mm i-line steppers, DUV stepper, and DUV scanners

Thorsten Schedel, Alain Charles, Dietmar Ganz, Steffen Hornig, Guenther Hraschan, Wolfram Koestler, John Maltabes, Karl Mautz, Thomas Metzdorf, Ralf Otto, Sebastian Schmidt, Ralf Schuster

Proceedings Volume 4000, (2000) https://doi.org/10.1117/12.389023

KEYWORDS: Semiconducting wafers, Scanners, Deep ultraviolet, Lithography, Particles, Critical dimension metrology, Semiconductors, Manufacturing, Contamination, Data processing

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Proceedings Article | 5 July 2000 Paper

Paper

Effect of nonlinear errors on 300-mm wafer overlay performance

Sebastian Schmidt, Alain Charles, Dietmar Ganz, Steffen Hornig, Guenther Hraschan, John Maltabes, Karl Mautz, Thomas Metzdorf, Ralf Otto, Jochen Scheurich, Thorsten Schedel, Ralf Schuster

Proceedings Volume 4000, (2000) https://doi.org/10.1117/12.389080

KEYWORDS: Semiconducting wafers, Optical alignment, Deep ultraviolet, Overlay metrology, Chemical mechanical planarization, Lithography, Semiconductors, Scanners, Manufacturing, Data acquisition

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Proceedings Article | 3 September 1999 Paper

Paper

Litho clusters with integrated metrology: the next step in continuous flow manufacturing

Tim Stanley, John Maltabes, Karl Mautz, James Dougan, Alain Charles, John Garbayo

Proceedings Volume 3882, (1999) https://doi.org/10.1117/12.361301

KEYWORDS: Metrology, Semiconducting wafers, Lithography, Manufacturing, Overlay metrology, Time metrology, Photoresist materials, Critical dimension metrology, Robotics, Inspection

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Proceedings Article | 3 September 1999 Paper

Paper

Current state of 300-mm lithography in a pilot line environment

Alain Charles, John Maltabes, Steffen Hornig, Thorsten Schedel, Dietmar Ganz, Sebastian Schmidt, Leroy Grant, Guenther Hraschan, Karl Mautz, Ralf Otto

Proceedings Volume 3882, (1999) https://doi.org/10.1117/12.361302

KEYWORDS: Semiconducting wafers, Lithography, Manufacturing, Scanners, Deep ultraviolet, Reliability, Thin film coatings, Wafer manufacturing, Contamination, Semiconductors

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Proceedings Article | 26 July 1999 Paper

Paper

Performance of 300-mm lithography tools in a pilot production line

John Maltabes, Alain Charles, Steffen Hornig, Thorsten Schedel, Dietmar Ganz, Sebastian Schmidt

Proceedings Volume 3679, (1999) https://doi.org/10.1117/12.354360

KEYWORDS: Semiconducting wafers, Scanners, Lithography, Manufacturing, Deep ultraviolet, Semiconductors, Wafer manufacturing, Thin film coatings, Photoresist materials, Optical alignment

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Proceedings Article | 8 June 1998 Paper

Paper

Manufacturability of subwavelength features using reticle and substrate enhancements

Martin McCallum, Kevin Lucas, John Maltabes, Michael Kling

Proceedings Volume 3332, (1998) https://doi.org/10.1117/12.308748

KEYWORDS: Reticles, Critical dimension metrology, Deep ultraviolet, Reflectivity, Lithography, Optical lithography, Optical proximity correction, Manufacturing, Silicon, Photoresist materials

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Proceedings Article | 7 July 1997 Paper

Paper

Full-field CD control for sub-0.20-um patterning

John Sturtevant, John Allgair, Mark Barrick, Chong-Cheng Fu, Kent Green, Robert Hershey, Lloyd Litt, John Maltabes, Carla Nelson-Thomas, Bernard Roman, John Singelyn

Proceedings Volume 3051, (1997) https://doi.org/10.1117/12.276024

KEYWORDS: Critical dimension metrology, Deep ultraviolet, Optical lithography, Lithography, Resistance, Manufacturing, Logic

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Proceedings Article | 8 August 1993 Paper

Paper

Cost/benefit analysis of mix-and-match lithography for production of half-micron devices

John Maltabes, Mark Hakey, Alan Levine

Proceedings Volume 1927, (1993) https://doi.org/10.1117/12.150478

KEYWORDS: Lithography, Optical lithography, Deep ultraviolet, Systems modeling, Manufacturing, Data modeling, Optics manufacturing, Software development, Performance modeling, Control systems

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Proceedings Article | 1 July 1991 Paper

Paper

Computer simulation of 0.5-micrometer lithography for a 16-megabit DRAM

John Maltabes, Katherine Norris, Dean Writer

Proceedings Volume 1463, (1991) https://doi.org/10.1117/12.44792

KEYWORDS: Lithography, Deep ultraviolet, Computer simulations, Manufacturing, Photomasks, Optics manufacturing, Optical aberrations, Lithographic equipment, Lithium, Optical lithography

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Proceedings Article | 1 June 1991 Paper

Paper

Airborne chemical contamination of a chemically amplified resist

Scott MacDonald, Nicholas Clecak, H. Wendt, C. Grant Willson, Clinton Snyder, C. Knors, N. Deyoe, John Maltabes, James Morrow, Anne McGuire, Steven Holmes

Proceedings Volume 1466, (1991) https://doi.org/10.1117/12.46354

KEYWORDS: Semiconducting wafers, Carbon, Lithography, Contamination, Manufacturing, Chemically amplified resists, Skin, Interfaces, Silicon, Liquids

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Proceedings Article | 1 June 1990 Open Access

Open Access

Paper

1X deep-UV lithography with chemical amplification for 1-micron DRAM production

John Maltabes, Steven Holmes, James Morrow, Roger Barr, Mark Hakey, Gregg Reynolds, William Brunsvold, C. Grant Willson, Nicholas Clecak, Scott MacDonald, Hiroshi Ito

Proceedings Volume 1262, (1990) https://doi.org/10.1117/12.20090

KEYWORDS: Deep ultraviolet, Semiconducting wafers, Image processing, Lithography, Manufacturing, Photoresist processing, Industrial chemicals, Radon, Photomasks, Chemically amplified resists

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Proceedings Article | 1 June 1990 Paper

Paper

Deep-ultraviolet lithography for 500-nm devices

Steven Holmes, Ruth Levy, Albert Bergendahl, Karey Holland, John Maltabes, Stephen Knight, Katherine Norris, Denis Poley

Proceedings Volume 1264, (1990) https://doi.org/10.1117/12.20180

KEYWORDS: Photomasks, Deep ultraviolet, Lithography, Optical lithography, Semiconducting wafers, Optical alignment, Image processing, Etching, Overlay metrology, Wafer-level optics

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Showing 5 of 29 publications

Conference Committee Involvement (12)

Novel Patterning Technologies 2022

25 April 2022 | San Jose, California, United States

Novel Patterning Technologies 2021

22 February 2021 | Online Only, California, United States

Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020

24 February 2020 | San Jose, California, United States

Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2019

25 February 2019 | San Jose, California, United States

Novel Patterning Technologies 2018

26 February 2018 | San Jose, California, United States

Showing 5 of 12 Conference Committees

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