Dr. Shaunee Y. Cheng Profile

Dr. Shaunee Y. Cheng

Manager, Metrology & Litho Process Equipment Dev at imec

SPIE Involvement:

Author

Publications (57)

Proceedings Article | 2 April 2014 Paper

Compensating process non-uniformity to improve wafer overlay by RegC

Philippe Leray, Shaunee Cheng, Avi Cohen, Erez Graitzer, Vladimir Dmitriev, Shiran Rehtan, Nadav Wertsman

Proceedings Volume 9050, 905015 (2014) https://doi.org/10.1117/12.2048081

KEYWORDS: Semiconducting wafers, Photomasks, Scanners, Overlay metrology, Process control, Optical lithography, Silica, Data modeling, Reticles, Data acquisition

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Proceedings Article | 2 April 2014 Paper

High speed optical metrology solution for after etch process monitoring and control

Anne-Laure Charley, Philippe Leray, Wouter Pypen, Shaunee Cheng, Alok Verma, Christine Mattheus, Baukje Wisse, Hugo Cramer, Henk Niesing, Stefan Kruijswijk

Proceedings Volume 9050, 90501H (2014) https://doi.org/10.1117/12.2047280

KEYWORDS: Etching, Critical dimension metrology, Metrology, Process control, Semiconducting wafers, Optical metrology, Inspection, Lithography, Double patterning technology, Overlay metrology

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Proceedings Article | 12 April 2013 Paper

Impact of process decisions and alignment strategy on overlay for the 14nm node

David Laidler, Koen D’havé, Philippe Leray, Jan Hermans, Juergen Boemmels, Shaunee Cheng, Huixiong Dai, Yongmei Chen, Bencherki Mebarki, Chris Ngai

Proceedings Volume 8683, 868306 (2013) https://doi.org/10.1117/12.2011968

KEYWORDS: Optical alignment, Etching, Back end of line, Metals, Copper, Double patterning technology, Chemical mechanical planarization, Scanners, Neodymium, Optical lithography

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Proceedings Article | 1 April 2013 Paper

Towards manufacturing a 10nm node device with complementary EUV lithography

Jan Hermans, Huixiong Dai, Ardavan Niroomand, David Laidler, Ming Mao, Yongmei Chen, Philippe Leray, Chris Ngai, Shaunee Cheng

Proceedings Volume 8679, 86791K (2013) https://doi.org/10.1117/12.2012136

KEYWORDS: Semiconducting wafers, Extreme ultraviolet lithography, Etching, Extreme ultraviolet, Reticles, Critical dimension metrology, Optical lithography, Line width roughness, Manufacturing, Overlay metrology

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Proceedings Article | 5 April 2012 Paper

Evaluation of roughness transfer from Litho to Etch using CD-SEM

M. Tanaka, T. Ishimoto, H. Kazumi, S. Cheng

Proceedings Volume 8324, 83242H (2012) https://doi.org/10.1117/12.917962

KEYWORDS: Image enhancement, Etching, Line width roughness, Line edge roughness, Scanning electron microscopy, Semiconductors, Critical dimension metrology, Metrology, Image quality, Semiconducting wafers

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Proceedings Article | 5 April 2012 Paper

Line-end gap measurement with YieldStar scatterometer: towards an OPC model calibration

A.-L. Charley, M. Dusa, T.-B. Chiou, P. Leray, S. Cheng, A. Fumar-Pici

Proceedings Volume 8324, 83242I (2012) https://doi.org/10.1117/12.918028

KEYWORDS: Metrology, Critical dimension metrology, Optical proximity correction, Calibration, Lithography, Scanning electron microscopy, Scatterometry, Scatter measurement, 3D metrology, Cadmium

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Proceedings Article | 5 April 2012 Paper

High-speed, full 3D feature metrology for litho monitoring, matching, and model calibration with scatterometry

Hugo Cramer, Alek Chen, Fahong Li, Philippe Leray, Anne-Laure Charley, Lieve van Look, Joost Bekaert, Shaunee Cheng

Proceedings Volume 8324, 83240R (2012) https://doi.org/10.1117/12.919050

KEYWORDS: Scatterometry, Scanners, 3D modeling, Optical proximity correction, 3D metrology, Calibration, Metrology, Lithography, Scatter measurement, Scanning electron microscopy

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Proceedings Article | 4 April 2012 Paper

Overlay accuracy with respect to device scaling

Philippe Leray, David Laidler, Shaunee Cheng

Proceedings Volume 8324, 832409 (2012) https://doi.org/10.1117/12.918017

KEYWORDS: Overlay metrology, Scanners, Etching, Optical design, Silicon, Metrology, Semiconducting wafers, Reticles, Diffraction, Neodymium

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Proceedings Article | 3 April 2012 Paper

Investigation of the performance of state-of-the-art defect inspection tools within EUV lithography

Dieter Van den Heuvel, Rik Jonckheere, Bart Baudemprez, Shaunee Cheng, Gino Marcuccilli, Andrew Cross, Gregg Inderhees, Paolo Parisi

Proceedings Volume 8324, 83240L (2012) https://doi.org/10.1117/12.916979

KEYWORDS: Inspection, Semiconducting wafers, Reticles, Wafer inspection, Photomasks, Etching, Wafer-level optics, Scanning electron microscopy, Defect detection, Defect inspection

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Proceedings Article | 14 March 2012 Paper

Progress in EUV lithography towards manufacturing from an exposure tool perspective

Jan Hermans, David Laidler, Philippe Foubert, Koen D'havé, Shaunee Cheng, Mircea Dusa, Eric Hendrickx

Proceedings Volume 8322, 832202 (2012) https://doi.org/10.1117/12.917616

KEYWORDS: Semiconducting wafers, Reticles, Optical alignment, Scanners, Extreme ultraviolet lithography, Overlay metrology, Critical dimension metrology, Extreme ultraviolet, Silicon, Manufacturing

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Proceedings Article | 13 March 2012 Paper

Mix and match overlay optimization strategy for advanced lithography tools (193i and EUV)

David Laidler, Koen D'havé, Jan Hermans, Shaunee Cheng

Proceedings Volume 8326, 83260M (2012) https://doi.org/10.1117/12.916969

KEYWORDS: Scanners, Extreme ultraviolet lithography, Overlay metrology, Extreme ultraviolet, Semiconducting wafers, Reticles, Optical alignment, Lithography, Metrology, Silicon

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Proceedings Article | 13 March 2012 Paper

Modeling for field-to-field overlay error

Koen D'havé, Shaunee Cheng

Proceedings Volume 8326, 83260U (2012) https://doi.org/10.1117/12.916345

KEYWORDS: Semiconducting wafers, Scanners, Overlay metrology, Reticles, Data modeling, Calibration, Motion models, Control systems, Optical lithography, Current controlled current source

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Proceedings Article | 30 September 2011 Paper

3D features measurement using YieldStar: an angle resolved polarized scatterometer

Anne-Laure Charley, Philippe Leray, Koen D'havé, Shaunee Cheng, Paul Hinnen, Fahong Li, Peter Vanoppen, Mircea Dusa

Proceedings Volume 8169, 81690Q (2011) https://doi.org/10.1117/12.897582

KEYWORDS: 3D metrology, Scatterometry, Critical dimension metrology, Metrology, Lithography, 3D modeling, Optical proximity correction, Diffraction, Calibration, Scatter measurement

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Proceedings Article | 20 April 2011 Paper

Diffraction based overlay re-assessed

Philippe Leray, David Laidler, Koen D'havé, Shaunee Cheng

Proceedings Volume 7971, 797114 (2011) https://doi.org/10.1117/12.882353

KEYWORDS: Overlay metrology, Calibration, Metrology, Semiconducting wafers, Process control, Etching, Silicon, Scanners, Metals, Diffraction

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Proceedings Article | 20 April 2011 Paper

3D features measurement using YieldStar, an angle resolved polarized scatterometer

Anne-Laure Charley, Philippe Leray, Koen D'havé, Shaunee Cheng, Paul Hinnen, Fahong Li, Peter Vanoppen, Mircea Dusa

Proceedings Volume 7971, 79712E (2011) https://doi.org/10.1117/12.881276

KEYWORDS: 3D metrology, Metrology, Critical dimension metrology, Lithography, Scatterometry, Scanning electron microscopy, Scatter measurement, 3D modeling, Optical proximity correction, Process control

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Proceedings Article | 20 April 2011 Paper

Calibration studies of pattern top resist loss detection by CD-SEM for advanced lithography process

Toru Ishimoto, Miki Isawa, Maki Tanaka, Shaunee Cheng

Proceedings Volume 7971, 79712H (2011) https://doi.org/10.1117/12.880916

KEYWORDS: Calibration, Semiconducting wafers, Metrology, Scanning electron microscopy, Photoresist processing, Surface roughness, Atomic force microscopy, Lithography, Process control, Wafer-level optics

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Proceedings Article | 20 April 2011 Paper

Verification and extension of the MBL technique for photo resist pattern shape measurement

Miki Isawa, Maki Tanaka, Hideyuki Kazumi, Chie Shishido, Akira Hamamatsu, Norio Hasegawa, Peter De Bisschop, David Laidler, Philippe Leray, Shaunee Cheng

Proceedings Volume 7971, 79710Z (2011) https://doi.org/10.1117/12.878960

KEYWORDS: Cadmium, Critical dimension metrology, Photoresist materials, Atomic force microscopy, Metrology, Scanning electron microscopy, Finite element methods, Terbium, Semiconducting wafers, Double patterning technology

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Proceedings Article | 23 March 2011 Paper

Optical proximity stability control of ArF immersion clusters

Lieve Van Look, Joost Bekaert, Koen D'havé, Bart Laenens, Geert Vandenberghe, Shaunee Cheng, Koen Schreel, Jan-Willem Gemmink

Proceedings Volume 7973, 79730R (2011) https://doi.org/10.1117/12.881606

KEYWORDS: Semiconducting wafers, Scanners, Fiber optic illuminators, Critical dimension metrology, Scatterometry, Diffractive optical elements, Scanning electron microscopy, Wafer-level optics, Photomasks, Control systems

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SPIE Journal Paper | 1 October 2010 Open Access

Special Section Guest Editorial: Metrology

Moshe Preil, Shaunee Cheng

JM3, Vol. 9, Issue 04, 041301, (October 2010) https://doi.org/10.1117/12.10.1117/1.3540417

KEYWORDS: Metrology, Critical dimension metrology, Overlay metrology, Semiconductors, Tolerancing, Silicon, Chemical species, Lithography, Calibration, Standards development

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Proceedings Article | 29 September 2010 Paper

Natural EUV mask blank defects: evidence, timely detection, analysis and outlook

Dieter Van den Heuvel, Rik Jonckheere, John Magana, Tsukasa Abe, Tristan Bret, Eric Hendrickx, Shaunee Cheng, Kurt Ronse

Proceedings Volume 7823, 78231T (2010) https://doi.org/10.1117/12.865812

KEYWORDS: Reticles, Inspection, Printing, Bismuth, Photomasks, Semiconducting wafers, Defect detection, Wafer inspection, Extreme ultraviolet, Atomic force microscopy

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